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GRC Science Area
IPS – Interconnect & Packaging Sciences
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- 1:
 3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 2:
Wafer Fabrication Monitoring/Control System and Method (Patent...
- Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
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- 3:
Conductors Created by Metal Deposition Using Selective Passivation...
- Conductors Created by Metal Deposition Using Selective Passivation Layer and Related Methods Application Type: Utility Patent Number: 7534967 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0447/
Modified: 2009-05-19 - 23KB
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- 4:
Surface Modifcation of CVD Polymer Films (Patent P0591) - SRC
- Surface Modifcation of CVD Polymer Films Application Type: Utility Patent Number: 7501154 Country: United States Status: Filed on 18-Feb-2005, Issued on 10-Mar-2009 Organization: ...
URL: https://www.src.org/library/patent/p0591/
Modified: 2009-03-10 - 22KB
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- 5:
High Gain Integrated Antenna and Devices Therefrom (Patent P0392...
- High Gain Integrated Antenna and Devices Therefrom Application Type: Utility Patent Number: 6842144 Country: United States Status: Filed on 10-Jun-2003, Issued on 11-Jan-2005, ...
URL: https://www.src.org/library/patent/p0392/
Modified: 2005-01-11 - 22KB
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- 6:
Self-Healing Analog-to-Digital Converters with Background Calibration...
- Self-Healing Analog-to-Digital Converters with Background Calibration Application Type: Utility Patent Number: 8330632 Country: United States Status: Filed on 11-Feb-2011, Issued ...
URL: https://www.src.org/library/patent/p1266/
Modified: 2012-12-11 - 22KB
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- 7:
Synthesis and Characterization of First Row Transition Metal...
- Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB
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- 8:
Synthesis and Characterization of First Row Transition Metal...
- Synthesis and Characterization of First Row Transition Metal Complexes Containing Alpha-Keto Hydrazonate Ligands as Potential Precursors for Use in Metal Film Deposition ...
URL: https://www.src.org/library/patent/p1356/
Modified: 2015-12-09 - 22KB
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- 9:
TECHCON 2013 (Event E004683) - SRC
- TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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- 10:
Integrated Tunable Inductors (Patent P1632) - SRC
- Integrated Tunable Inductors Application Type: Utility Patent Number: 9881731 Country: United States Status: Filed on 14-Jun-2016, Issued on 30-Jan-2018 Organization: Arizona State ...
URL: https://www.src.org/library/patent/p1632/
Modified: 2018-01-30 - 24KB
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- 11:
Low Temperature Metal Etching and Patterning (Patent P1290) ...
- Low Temperature Metal Etching and Patterning Application Type: Utility Patent Number: 8679359 Country: United States Status: Filed on 10-May-2011, Issued on 25-Mar-2014 ...
URL: https://www.src.org/library/patent/p1290/
Modified: 2014-03-25 - 23KB
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- 12:
Methods and Apparatuses for Integrated Packaging of Microelectromechan...
- Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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- 13:
Mixed-signal Substrate with Integrated Through-Substrate Vias...
- Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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- 14:
Low Dielectric Constant (Low-K) Dielectric and Method of Forming...
- Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same Application Type: Utility Patent Number: 10090150 Country: United States Status: Filed on 6-Sep-2017, ...
URL: https://www.src.org/library/patent/p1731/
Modified: 2018-10-02 - 24KB
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- 15:
Composite Thermal Interface Material Including Aligned Nanofibers...
- Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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- 16:
Multilevel Reservoirs for Integrated Circuit Interconnects (Patent...
- Multilevel Reservoirs for Integrated Circuit Interconnects Application Type: Utility Patent Number: 8278758 Country: United States Status: Filed on 29-Apr-2009, Issued on ...
URL: https://www.src.org/library/patent/p1141/
Modified: 2012-10-02 - 22KB
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- 17:
Oxidation Resistant PB-Free Solder Alloys (Patent P1108) - SRC
- Oxidation Resistant PB-Free Solder Alloys Application Type: Utility Patent Number: 8530058 Country: United States Status: Filed on 6-Mar-2009, Issued on 10-Sep-2013, Patent ...
URL: https://www.src.org/library/patent/p1108/
Modified: 2013-09-10 - 22KB
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- 18:
Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor...
- Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor Devices Application Type: Utility Patent Number: 7081674 Country: United States Status: Filed on 11-Jun-2004, ...
URL: https://www.src.org/library/patent/p0466/
Modified: 2006-07-25 - 22KB
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- 19:
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
- Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB
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- 20:
Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
- Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
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- 21:
Systems for Performing Chemical Mechanical Planarization and...
- Systems for Performing Chemical Mechanical Planarization and Process for Conducting Same Application Type: Utility Patent Number: 5637185 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0012/
Modified: 1997-06-10 - 24KB
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- 22:
Growth of Inorganic Thin Films using Self-Assembled Monolayers...
- Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB
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- 23:
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
- Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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- 24:
Composite Thermal Interface Material Including Particles and...
- Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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- 25:
Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers...
- Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers and Diffusion Barriers Application Type: Utility Patent Number: 7026716 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0415/
Modified: 2006-04-11 - 22KB
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- 26:
Oxidation Resistant High Conductivity Copper Layers for Microelectric...
- Oxidation Resistant High Conductivity Copper Layers for Microelectric Applications and Process of Making Same Application Type: Utility Patent Number: 5622608 Country: United ...
URL: https://www.src.org/library/patent/p0007/
Modified: 1997-04-22 - 22KB
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- 27:
Systems, Methods and Computer Program Products for Prediction...
- Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
URL: https://www.src.org/library/patent/p0050/
Modified: 1998-10-13 - 22KB
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- 28:
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
- Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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- 29:
Methods, Systems, and Computer Program Products for Asymmetric...
- Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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- 30:
Multiple Copper Vias for Integrated Circuit Metallization and...
- Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
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