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CM – Compact Modeling

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1: Methods and Apparatuses for Integrated Packaging of Microelectromechan...
Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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