[x]
Thrust/Theme
PKG – Packaging
[x]
GRC Science Area
IPS – Interconnect & Packaging Sciences
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| 1 through 13 of
13 similar documents, best matches first. |
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- 1:
 3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 2:
Integrated Tunable Inductors (Patent P1632) - SRC
- Integrated Tunable Inductors Application Type: Utility Patent Number: 9881731 Country: United States Status: Filed on 14-Jun-2016, Issued on 30-Jan-2018 Organization: Arizona State ...
URL: https://www.src.org/library/patent/p1632/
Modified: 2018-01-30 - 24KB
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- 3:
Methods and Apparatuses for Integrated Packaging of Microelectromechan...
- Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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- 4:
Mixed-signal Substrate with Integrated Through-Substrate Vias...
- Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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- 5:
Composite Thermal Interface Material Including Aligned Nanofibers...
- Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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- 6:
Oxidation Resistant PB-Free Solder Alloys (Patent P1108) - SRC
- Oxidation Resistant PB-Free Solder Alloys Application Type: Utility Patent Number: 8530058 Country: United States Status: Filed on 6-Mar-2009, Issued on 10-Sep-2013, Patent ...
URL: https://www.src.org/library/patent/p1108/
Modified: 2013-09-10 - 22KB
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- 7:
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
- Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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- 8:
Composite Thermal Interface Material Including Particles and...
- Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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- 9:
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
- Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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- 10:
Methods, Systems, and Computer Program Products for Asymmetric...
- Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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- 11:
Systems, Methods, and Computer Readable Media for Fractional...
- Systems, Methods, and Computer Readable Media for Fractional Pre-emphasis of Multi-Mode Interconnect Application Type: Utility Patent Number: 8208578 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1191/
Modified: 2012-06-26 - 22KB
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- 12:
Methods, Systems, and Computer Program Products for Low Power...
- Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB
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- 13:
Mixed-Signal Systems With Alternating Impedance Electromagnetic...
- Mixed-Signal Systems With Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structures For Noise Suppression/Isolation Application Type: Continuation (in part) Patent Number: ...
URL: https://www.src.org/library/patent/p0578/
Modified: 2007-08-07 - 22KB
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