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- 1:
Multiple Copper Vias for Integrated Circuit Metallization and...
- Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
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- 2:
Passivated Copper Conductive Layers for Microelectronic Applications...
- Passivated Copper Conductive Layers for Microelectronic Applications and Methods of Manufacturing Same Application Type: Utility Patent Number: 5766379 Country: United States ...
URL: https://www.src.org/library/patent/p0015/
Modified: 1998-06-16 - 24KB
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- 3:
Films for Use in Microelectronic Devices and Methods of Producing...
- Films for Use in Microelectronic Devices and Methods of Producing Same Application Type: Utility Patent Number: 6306495 Country: United States Status: Filed on 27-Jul-2000, Issued ...
URL: https://www.src.org/library/patent/p0156/
Modified: 2001-10-23 - 22KB
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- 4:
Films for Use in Microelectronic Devices and Methods of Producing...
- Films for Use in Microelectronic Devices and Methods of Producing Same Application Type: Utility Patent Number: 6114032 Country: United States Status: Filed on 10-Apr-1998, Issued ...
URL: https://www.src.org/library/patent/p0155/
Modified: 2000-09-05 - 22KB
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