Questions?
[x] SRC Program
GRC

[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 25
Patent Filings 16
Other 1

Year
2015 3
2011 22

Center
TxACE 5
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
EBSM 1
IPC 1
NCRC 1

Thrust/Theme
TT – Test & Testability 18
CADT – Computer-Aided Design and... 9
VER – Verification 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
CD – Circuit Design 4
HWS – Hardware Security 4
ISD – Integrated System Design 4
LPD – Logic & Physical Design 4
SLD – System Level Design 4
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

1 through 30 of 42 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: pdfSRC/NSF Design Forum - Posiltion Statement
Future Directions for Design Automation Research Tim Cheng, UCSB In my opinion, the following are three key challenges for future design automation research. Silicon Debugging: The ...
URL: https://www.src.org/...2764/tim-cheng-position-statement.pdf
Modified: 2011-08-02 - 14KB
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2: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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3: India Design Review (Event E005563) - SRC
India Design Review Date: Wednesday, Jan. 7, 2015, 6 p.m. - Thursday, Jan. 8, 2015, 5 p.m. Local Location: Hyatt Bangalore, 1/1, Swami Vivekananda Road, Off M.G. Road, Ulsoor, ...
URL: https://www.src.org/calendar/e005563/
Modified: 2015-02-04 - 82KB
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4: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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5: pdfDesign Forum: Hugo De Man Position Statement
Some (possibly controversial) thoughts H. De Man, Em. Prof. K.U.Leuven, Senior Fellow IMEC, deman@imec.be The right questions are formulated. One could start suggestions for ...
URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
Modified: 2011-08-02 - 36KB
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6: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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7: pdfState-of-the-3D Industry Future Opportunities and Challenges
Rev 2.0 1  Building the Case for 3D  3D Vs. Scaling  Technology Roadmap  Technology Hurdles  Psycho-political Hurdles  Evolutionary vs. Revolutionary  The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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8: pdfDesign Forum: Sharad Malik Panel Position Statement
Making our Way through the End-of-the Roadmap Maze Panel Position Statement Sharad Malik Princeton University As we look forward over the next 10-15 years, there are several ...
URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
Modified: 2011-08-02 - 20KB
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9: pdfSRC/NSF Design Forum - Position Statement
A Forum on Future Directions for Design Automation Research Juan C. Rey Senior Director Of Engineering Design to Silicon Division Mentor Graphics Corporation October, 2006 10:30 ...
URL: https://www.src.org/...02764/juan-rey-position-statement.pdf
Modified: 2011-08-02 - 13KB
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10: Signal Tracing Using On-Chip Memory For In-System Post-Fabrication...
Signal Tracing Using On-Chip Memory For In-System Post-Fabrication Debug Application Type: Utility Patent Number: 9720036 Country: United States Status: Filed on 18-Aug-2014, ...
URL: https://www.src.org/library/patent/p1495/
Modified: 2017-08-01 - 23KB
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11: Signal Tracing using ON-Chip Memory for In-System Post-Fabrication...
Signal Tracing using ON-Chip Memory for In-System Post-Fabrication Debug Application Type: Continuation Patent Number: 10732221 Country: United States Status: Filed on 26-Jun-2017, ...
URL: https://www.src.org/library/patent/p1733/
Modified: 2020-08-04 - 24KB
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12: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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13: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
Modified: 2011-08-02 - 16KB
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14: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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15: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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16: pdfSRC/NSF Design Forum - Position Statement
NSF/SRC Forum on Future Directions for Design Automation Research Top Three Challenges for Electronic Design Automation Sachin Sapatnekar, University of Minnesota As system ...
URL: https://www.src.org/...hin-sapatnekar-position-statement.pdf
Modified: 2011-08-02 - 15KB
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17: pdfSRC/NSF Design Forum - Position Statement
SRC/NSF Workshop on Future Directions for Design Automation Research Comments by David Yeh, Texas Instruments, currently an assignee at SRC I approached this from two perspectives. ...
URL: https://www.src.org/...2764/david-yeh-position-statement.pdf
Modified: 2011-08-02 - 12KB
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18: pdfSRC/NSF Design Forum - Position Statement
© R.A. Rutenbar 2006 NSF Forum on Future Directions for Design Automation Research Increased Diversity: Position Statement NSF Forum on Future Directions for Design Automation ...
URL: https://www.src.org/...4/rob-rutenbar-position-statement.pdf
Modified: 2011-08-02 - 99KB
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19: pdfSRC/NSF Design Forum - Position Statement
ATT4457633.txt Views on Important Direction in Design Automation J. White Professor, Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology ...
URL: https://www.src.org/...64/jacob-white-position-statement.pdf
Modified: 2011-08-02 - 21KB
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20: pdfPowerPoint Presentation
RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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21: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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22: pdfDesign Forum: Ken Shepard Position Statement
Future of Design Automation Research Ken Shepard, Columbia University I would like to highlight the following three challenges for future design automation research. Broadly, these ...
URL: https://www.src.org/...64/ken-shepard-position-statement.pdf
Modified: 2011-08-02 - 64KB
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23: Testing Monolithic Three Dimensional Integrated Circuits (Patent...
Testing Monolithic Three Dimensional Integrated Circuits Application Type: Utility Patent Number: 10775429 Country: United States Status: Filed on 2-Nov-2017, Issued on 15-Sep-2020 ...
URL: https://www.src.org/library/patent/p1746/
Modified: 2020-09-15 - 25KB
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24: Multi-Layer Integrated Circuits Having Isolation Cells for Layer...
Multi-Layer Integrated Circuits Having Isolation Cells for Layer Testing and Related Methods Application Type: Continuation (in part) Patent Number: 10838003 Country: United States ...
URL: https://www.src.org/library/patent/p1826/
Modified: 2020-11-17 - 25KB
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25: Multi-Layer Integrated Circuits Having Isolation Cells for Layer...
Multi-Layer Integrated Circuits Having Isolation Cells for Layer Testing and Related Methods Application Type: Utility Patent Number: 10338133 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p1639/
Modified: 2019-07-02 - 25KB
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26: Software-Based Self-Test and Diagnosis Using on-Chip Memory ...
Software-Based Self-Test and Diagnosis Using on-Chip Memory Application Type: Divisional Patent Number: 10788532 Country: United States Status: Filed on 30-Nov-2017, Issued on ...
URL: https://www.src.org/library/patent/p1753/
Modified: 2020-09-29 - 26KB
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27: Software-Based Self-Test and Diagnosis Using on-Chip Memory ...
Software-Based Self-Test and Diagnosis Using on-Chip Memory Application Type: Divisional Patent Number: 10845416 Country: United States Status: Filed on 30-Nov-2017, Issued on ...
URL: https://www.src.org/library/patent/p1752/
Modified: 2020-11-24 - 26KB
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28: Software-Based Self-Test and Diagnosis Using On-Chip Memory ...
Software-Based Self-Test and Diagnosis Using On-Chip Memory Application Type: Utility Patent Number: 9864007 Country: United States Status: Filed on 30-Apr-2014, Issued on ...
URL: https://www.src.org/library/patent/p1457/
Modified: 2018-01-09 - 25KB
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29: pdfDesign Forum: David Kung Position Statement
Future of Design Automation To determine the future direction of Design Automation, we need to take a careful look at the trends in design (systems and circuits) and technology. On ...
URL: https://www.src.org/...764/david-kung-position-statement.pdf
Modified: 2011-08-02 - 33KB
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30: Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple...
Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple Voltage Levels Application Type: Continuation Patent Number: 10444279 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1635/
Modified: 2019-10-15 - 23KB
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1 through 30 of 42 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>