[x]
Thrust/Theme
PKG – Packaging
[x]
GRC Science Area
IPS – Interconnect & Packaging Sciences
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1 through 2 of
2 similar documents, best matches first. |
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- 1:
Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB Find Similar Documents
- 2:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB Find Similar Documents
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