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| 1 through 4 of 4 similar documents, best matches first. | ||
- 1: Signal Tracing Using On-Chip Memory For In-System Post-Fabrication...
- Signal Tracing Using On-Chip Memory For In-System Post-Fabrication Debug Application Type: Utility Patent Number: 9720036 Country: United States Status: Filed on 18-Aug-2014, ...
URL: https://www.src.org/library/patent/p1495/
Modified: 2017-08-01 - 23KB
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- 2: Signal Tracing using ON-Chip Memory for In-System Post-Fabrication...
- Signal Tracing using ON-Chip Memory for In-System Post-Fabrication Debug Application Type: Continuation Patent Number: 10732221 Country: United States Status: Filed on 26-Jun-2017, ...
URL: https://www.src.org/library/patent/p1733/
Modified: 2020-08-04 - 24KB
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- 3: Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple...
- Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple Voltage Levels Application Type: Continuation Patent Number: 10444279 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1635/
Modified: 2019-10-15 - 23KB
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- 4: Non-Invasive Pre-Bond TSV TestUsing Ring Oscillators and Multiple...
- Non-Invasive Pre-Bond TSV TestUsing Ring Oscillators and Multiple Voltage Levels Application Type: Utility Patent Number: 9478720 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1392/
Modified: 2016-11-01 - 24KB
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