Questions?
Content Type
Other 212
Patent Filings 152
Events 138

SRC Program
GRC 214
SRC 154
NRI 37
STARnet 35
nCORE 21
FCRP 20
JUMP2 14
JUMP 10
3D EC 1
ICA 1
MSR-Intel 1
SRP 1

Year
2024 12
2023 21
2022 24
2021 25
2020 10
2019 9
2018 12
2017 26
2016 13
2015 8
2014 8
2013 12
2012 14
2011 76
2010 76
2009 1

Center
C-SPIN 19
FAME 13
AMML 8
C2S2 7
CNFD 7
GSRC 7
INDEX 7
CHIRP 6
LEAST 6
MSD 6
NEWLIMITS 6
SWAN 6
TxACE 6
Benchmarking 5
C-FAR 5
IFC 5
ACE4S 4
CBRIC 4
IMPACT 4
MIND 4
NRI-NSF 4
TerraSwarm 4
ASCENT 3
CAPSL 3
CRISP 3
E2CDA-NRI 3
EBSM 3
FENA 3
WIN 3
DEEP3M 2
MuSyC 2
SONIC 2
ACE 1
CAIST 1
CDADIC 1
CEMPI 1
E2CDA 1
IPC 1
NCRC 1
NPT 1

Thrust/Theme
CD – Circuit Design 9
PKG – Packaging 9
AMML-T1 – Antiferromagnetic Magn... 8
Advanced Devices & Technologies 8
PAT – Patterning 8
LMD – Logic and Memory Devices 7
Factory Systems 6
I3T – Innovative and Intelligent... 5
NEM – Nanoengineered Materials 5
SLD – System Level Design 5
TT – Test & Testability 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
CADT – Computer-Aided Design and... 4
DesTech – Design Techniques 4
CAPSL-T4 – Architectures and Sys... 3
HWS – Hardware Security 3
IMPACT-T1 – Materials for Scaled... 3
NEWLIMITS-T2 – 2D Materials Devi... 3
NMP – Nanomanufacturing Material... 3
TechCAD – Technology CAD 3
VER – Verification 3
AIHW – Artificial Intelligence H... 2
CAPSL-T1 – Materials Development... 2
CAPSL-T2 – P-transistors for PSL... 2
CAPSL-T3 – Device Models and Tut... 2
CBRIC-T1 – Neuro-inspired Algori... 2
CBRIC-T2 – Neuromorphic Fabrics 2
CRISP-T3 – Scaling Applications ... 2
DEEP3M-T2 – Circuits 2
DEEP3M-T4 – Architectures 2
DV – Design Verification 2
ESH – Environment Safety and Hea... 2
IMPACT-T2 – Materials for Storag... 2
Materials 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
Pat(MPS) – Patterning 2
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
ASCENT-T2 – Beyond CMOS 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CRISP-T1 – Hardware Support for ... 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1

GRC Science Area
CADTS – Computer Aided Design & ... 24
NMS – Nanomanufacturing Sciences 22
NIS – Nanostructure & Integratio... 21
ICSS – Integrated Circuit & Syst... 17
MPS – Material & Process Science... 10
DES – Design Sciences 9
MIC – Microstructure Sciences 9
IPS – Interconnect & Packaging S... 8
PID – Process Integration & Devi... 8
MBP – Materials & Bulk Processes... 7
PKG – Packaging Sciences 5
CSR – Cross-disciplinary Semicon... 4
DS – Device Sciences 4
LIT – Lithography Sciences 4
SRCEA – SRC Education Alliance 3
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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121: pdfSRC GRC: Nano-Morphic Forum - P4 Meyyappan
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124: pdfResearch Needs: Logic and Memory Devices (LMD)
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129: Converting Ta- and Ti-Based Cu Diffusion Barriers into their...
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133: 2020 Mahboob Khan Outstanding Liaison Award Winners - SRC
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145: 2017 Mahboob Khan Outstanding Liaison Award Winners - SRC
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148: pdfPackaging Research Needs Document
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