Questions?
Content Type
Patent Filings 151
Other 150
Events 98

SRC Program
SRC 154
STARnet 101
GRC 50
NRI 34
nCORE 22
JUMP2 19
JUMP 17
FCRP 9
ICA 1
SRP 1

Year
2024 10
2023 19
2022 32
2021 21
2020 12
2019 9
2018 6
2017 21
2016 7
2015 9
2014 4
2013 10
2012 13
2011 20
2010 49
2008 1

Center
C-SPIN 41
LEAST 22
C-FAR 19
FAME 18
SONIC 11
CBRIC 10
INDEX 9
CRISP 8
AMML 7
SWAN 7
CNFD 6
NEWLIMITS 6
NRI-NSF 6
TxACE 6
Benchmarking 5
C2S2 5
CHIRP 5
E2CDA-NRI 5
TerraSwarm 5
DEEP3M 4
GSRC 4
IMPACT 4
MIND 4
MSD 4
WIN 4
ADA 3
ASCENT 3
CAPSL 3
EBSM 3
SUPREME 3
ACE 2
CUBIC 2
FENA 2
IFC 2
MuSyC 2
SMART 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1

Thrust/Theme
AMML-T1 – Antiferromagnetic Magn... 7
CD – Circuit Design 7
CBRIC-T1 – Neuro-inspired Algori... 6
CRISP-T1 – Hardware Support for ... 6
PKG – Packaging 6
CBRIC-T2 – Neuromorphic Fabrics 5
DEEP3M-T4 – Architectures 4
ADA-T1 – Deft Development 3
AMS-CSD – Analog/Mixed-Signal Ci... 3
CAPSL-T4 – Architectures and Sys... 3
CRISP-T3 – Scaling Applications ... 3
HWS – Hardware Security 3
IMPACT-T1 – Materials for Scaled... 3
LMD – Logic and Memory Devices 3
NEWLIMITS-T2 – 2D Materials Devi... 3
SLD – System Level Design 3
AIHW – Artificial Intelligence H... 2
CADT – Computer-Aided Design and... 2
CAPSL-T1 – Materials Development... 2
CAPSL-T2 – P-transistors for PSL... 2
CAPSL-T3 – Device Models and Tut... 2
DEEP3M-T2 – Circuits 2
ESH – Environment Safety and Hea... 2
IMPACT-T2 – Materials for Storag... 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
NEM – Nanoengineered Materials 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
NMP – Nanomanufacturing Material... 2
SMART-T1 – Spin-orbit Torque Mat... 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
ASCENT-T2 – Beyond CMOS 1
ASCENT-T3 – Heterogeneous Integr... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T1 – ARENA Integrator 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 10
NMS – Nanomanufacturing Sciences 8
CADTS – Computer Aided Design & ... 6
IPS – Interconnect & Packaging S... 5
CSR – Cross-disciplinary Semicon... 4
DS – Device Sciences 4
PKG – Packaging Sciences 3
SRCEA – SRC Education Alliance 2
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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48: Phased Transition Based Resistive Random-Access Memory (Patent...
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50: Memory Cell With Built-In Process Variation Tolerance (Patent...
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59: Magnetic Tunnel Junctions with Voltage Tunable Interlayer Coupling...
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