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- 61:
Microsoft Word - Interface Research Needs.doc
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB Find Similar Documents
- 62:
S200807_research_needs_INT.doc
- Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB Find Similar Documents
- 63:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB Find Similar Documents
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