Questions?
[x] SRC Program
GRC

Content Type
Other 139
Events 113

Year
2024 1
2023 8
2022 12
2021 9
2020 7
2019 8
2018 10
2017 6
2016 10
2015 9
2014 4
2013 4
2012 4
2011 112
2010 46
2009 1

Center
CHIRP 7
TxACE 4
EBSM 3
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 12
ESH – Environment Safety and Hea... 4
HWS – Hardware Security 3
LMD – Logic and Memory Devices 3
NMP – Nanomanufacturing Material... 3
AMS-CSD – Analog/Mixed-Signal Ci... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 16
ICSS – Integrated Circuit & Syst... 16
NMS – Nanomanufacturing Sciences 12
IPS – Interconnect & Packaging S... 10
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 3
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

1 through 30 of 252 similar documents, best matches first.   
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1: pdfHeterogeneous Integration of Packaging Key Conclusions Stanford...
SRC Colloquium - Heterogeneous Integration of Packaging Key Conclusions Stanford University 9/11/2018 Key Conclusions from Panelists (1/2) . Over-arching consensus - Heterogeneous ...
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Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
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3: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
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4: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
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5: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
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6: pdfSummary Report - SRC/NSF Workshop on Microsystems for Bioelectronic...
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Managed Crosscuts Overview There are many semiconductor technology disciplines that are common to more than one thrust area. Research in one thrust area on a particular crosscut ...
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10: pdfPackaging Research Needs Document
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URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
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11: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
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12: pdf2011-2015 SRC-GRC Strategic Plan
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13: pdfPresentation Title
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15: pdfNMS Research Needs Document, Version 1
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17: 2006 GRC compelling research reasons - SRC
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18: pdf2010 SRC Operations Plan
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19: pdf2010 NMS Research Needs in patterning, nanoengineered materials...
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20: pdfMicrosoft Word - Interface Research Needs.doc
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21: pdfS200807_research_needs_INT.doc
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22: pdfDesign Forum: David Kung Position Statement
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23: pdfSSB Roadmap - final
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25: pdfMicrosoft Word - 2022_pkg_needs_final.docx
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26: pdfPackaging Research Needs Document
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27: pdfPackaging Research Needs Document
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28: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
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29: SRC Heterogeneous Integration Colloquium (Event E006526) - SRC
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URL: https://www.src.org/calendar/e006526/
Modified: 2019-03-11 - 30KB
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30: pdfMicrosoft Word - Pkg Needs 2005.doc
Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
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1 through 30 of 252 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 next >>