Questions?
[x] SRC Program
GRC

Content Type
Events 138
Other 133
Patent Filings 20

Year
2024 1
2023 10
2022 16
2021 7
2020 6
2019 6
2018 14
2017 6
2016 10
2015 16
2014 4
2013 6
2012 2
2011 127
2010 38
2009 1

Center
TxACE 9
CHIRP 7
EBSM 5
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
TT – Test & Testability 18
CADT – Computer-Aided Design and... 11
PKG – Packaging 10
HWS – Hardware Security 7
ESH – Environment Safety and Hea... 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
NMP – Nanomanufacturing Material... 5
VER – Verification 5
CD – Circuit Design 4
ISD – Integrated System Design 4
LMD – Logic and Memory Devices 4
LPD – Logic & Physical Design 4
SLD – System Level Design 4
I3T – Innovative and Intelligent... 2
Modeling & Simulation 2
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 42
ICSS – Integrated Circuit & Syst... 26
NMS – Nanomanufacturing Sciences 12
IPS – Interconnect & Packaging S... 10
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

61 through 90 of 291 similar documents, best matches first.   
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61: pdfIRP Advisory Board Meeting
Hardware Security e-Kickoff February 6, 2023 Virtual John Oakley, Science Director LaDonya Dooley, Research Program Coordinator https://www.src.org/calendar/e007735/ Because the ...
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62: pdfPresentation Title
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Modified: 2011-05-04 - 2.4MB
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63: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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64: pdfMicrosoft Word - Interface Research Needs.doc
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
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65: pdfSRC: Research Needs for Integrated System Design - January 2001
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66: pdfS200807_research_needs_INT.doc
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67: pdfPackaging Research Needs Document
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Modified: 2018-06-22 - 175KB
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68: pdf2006 Circuit Design Needs Categories
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Modified: 2022-04-27 - 284KB
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69: pdfAMS-CSD Needs Document - FINAL - June 20, 2016
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70: pdf2006 Circuit Design Needs Categories
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71: pdfState-of-the-3D Industry Future Opportunities and Challenges
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URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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72: pdfSlide 1
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Modified: 2010-11-29 - 52.6MB
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73: pdfDesign Forum: Sharad Malik Panel Position Statement
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URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
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74: pdfIRP Advisory Board Meeting
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75: pdf2010 NMS Research Needs in patterning, nanoengineered materials...
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76: pdfVirtual John Oakley, Science Director Tameka Bell & Mary Nichols...
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78: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
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79: pdfMicrosoft Word - SRCTAB_ResearchPrioritiesDSRCCLMay162014j.doc
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80: pdfVIA-2020 Forum - Panel 4 - Shankar
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81: pdfEnvironment, Safety, and Health Needs Document
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82: pdfSRC Workshop on EDA/BDA Interaction Roadmap - Final Report
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URL: https://www.src.org/...098-eda-bda-workshop-final-report.pdf
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83: pdf2009 Summer Study: Co-Design of Future Architectures with 3D...
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Modified: 2011-06-17 - 1.5MB
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84: pdfSRC/NSF Design Forum - Position Statement
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85: Signal Tracing Using On-Chip Memory For In-System Post-Fabrication...
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Modified: 2017-08-01 - 23KB
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86: Signal Tracing using ON-Chip Memory for In-System Post-Fabrication...
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URL: https://www.src.org/library/patent/p1733/
Modified: 2020-08-04 - 24KB
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87: pdfCADT Research Needs Document - June 2018
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URL: https://www.src.org/...search-needs/2018/2018_cadt_needs.pdf
Modified: 2018-06-11 - 98KB
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88: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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89: pdfCADTS LPD Needs Document
Logic, Physical, and System Design Tools SRC GRC CADTS Needs May 2011 The Computer-Aided Design and Test Sciences area of the Semiconductor Research Corporation's Global Research ...
URL: https://www.src.org/...grc/cadts/research-needs/2010/lpd.pdf
Modified: 2011-05-26 - 26KB
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90: GRC Managed Crosscuts - SRC
Managed Crosscuts Overview There are many semiconductor technology disciplines that are common to more than one thrust area. Research in one thrust area on a particular crosscut ...
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Modified: 2010-06-21 - 38KB
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61 through 90 of 291 similar documents, best matches first.   
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