Questions?
[x] SRC Program
GRC

Content Type
Other 146
Events 140
Patent Filings 5

Year
2024 1
2023 10
2022 15
2021 9
2020 8
2019 8
2018 17
2017 7
2016 10
2015 15
2014 3
2013 4
2012 3
2011 132
2010 42
2009 1

Center
TxACE 9
CHIRP 7
EBSM 3
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 10
AMS-CSD – Analog/Mixed-Signal Ci... 6
HWS – Hardware Security 6
ESH – Environment Safety and Hea... 5
SLD – System Level Design 5
CADT – Computer-Aided Design and... 4
CD – Circuit Design 4
DesTech – Design Techniques 4
ISD – Integrated System Design 4
LMD – Logic and Memory Devices 4
LPD – Logic & Physical Design 4
NMP – Nanomanufacturing Material... 4
TT – Test & Testability 4
VER – Verification 4
Physical Design 3
AIHW – Artificial Intelligence H... 2
EP3C – Efficiency and Performanc... 2
I3T – Innovative and Intelligent... 2
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 30
ICSS – Integrated Circuit & Syst... 25
NMS – Nanomanufacturing Sciences 12
IPS – Interconnect & Packaging S... 9
PKG – Packaging Sciences 5
DES – Design Sciences 4
ES-H – Environmental Safety & He... 4
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

271 through 291 of 291 similar documents, best matches first.   
<< previous Page: 1 2 3 4 5 6 7 8 9 10 Results by:Thunderstone
271: pdfIRP Advisory Board Meeting
AMS-CSD Research Program Annual Review Oct 17-20, 2023 UT Dallas, TX Marcus Pan, Science Director LaTanya Holmes, Research Program Coordinator https://www.src.org/calendar/e007770/ ...
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272: pdfPowerPoint Presentation
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273: The Challenges and Opportunities of Atomic Layer Etching (Event...
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274: Moshe Preil abstract - SRC
Abstract: Research Challenges for Usable Multi-Beam Maskless Lithography (ML2) Moshe Preil Manager, Emerging Lithography & Tools GLOBALFOUNDRIES Eliminating the cost of the mask ...
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276: Taller vs. Smaller: 3D Development and Moore's Law - SRC
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277: pdfS200807_research_needs_BEP.doc
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278: pdfMicrosoft Word - BEP_Research_Needs.doc
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279: pdfE003676 - Memory Forum - Perspectives on ReEAM Technologies
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280: pdfMicrosoft Word - ITRSpaperfinal.doc
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281: pdfNano-Scale Memory Devices: Space-Time_Energy Trade-offs
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284: pdfMicrosoft Word - Executive Summary Greg Fuchs
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285: pdfPresentation Title Here
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286: pdfSRC GRC: Nano-Morphic Forum - P4 Zhirnov
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287: pdfState-of-the-3D Industry Future Opportunities and Challenges
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288: pdfE003676 - Memory Forum - Strukov
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289: Liaison Handbook - SRC
Liaison Handbook Introduction Initiated in 1983, the Liaison Program is a powerful partnership that brings together university researchers, graduate students and industry experts ...
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290: pdfスライド 1
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291: pdfVIA-2020 Forum - Panel 4 Presentation - Cavin
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271 through 291 of 291 similar documents, best matches first.   
<< previous Page: 1 2 3 4 5 6 7 8 9 10 Results by:Thunderstone